Translator Disclaimer
15 October 2001 Preparation and performance of silicon microchannel plate
Author Affiliations +
Proceedings Volume 4601, Micromachining and Microfabrication Process Technology and Devices; (2001) https://doi.org/10.1117/12.444697
Event: International Symposium on Optoelectonics and Microelectronics, 2001, Nanjing, China
Abstract
A silicon microchannel plate (Si-MCP), with 15-25 aspect ratio of the microchannel, 6-20 microns diameter and 6-8 microns space, was prepared by Inductively Coupled Plasma (ICP) and LPCVD. The inner surface topography of microchannel was surveyed, the bulk resistance 7.3 mega ohm and electron gain 110 of MCP were tested by ultraviolet optoelectronic method. The plasma-etching lag in processing the microchannel array was analyzed and discussed. Finally, we compared the electron gain of silicon microchannel plate with traditional glass one. Our work proved the feasibility of making Si-MCP by microfabrication and semiconductor process.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Qingduo Duanmu, Jingquan Tian, Ye Li, Tangren Dan, Yaohua Lu, Delong Jiang, and Lichen Fu "Preparation and performance of silicon microchannel plate", Proc. SPIE 4601, Micromachining and Microfabrication Process Technology and Devices, (15 October 2001); https://doi.org/10.1117/12.444697
PROCEEDINGS
4 PAGES


SHARE
Advertisement
Advertisement
Back to Top