Experimental methods for thermomechanical characterization of electronic packages: a review and evaluation

Fei Su; Sung Yi; Fulong Dai; Huimin Xie; Mehu Vora; Xiaoyuan He

doi:10.1117/12.445732

16 October 2001 Experimental methods for thermomechanical characterization of electronic packages: a review and evaluation

Fei Su, Sung Yi, Fulong Dai, Huimin Xie, Mehu Vora, Xiaoyuan He

Author Affiliations +

Proceedings Volume 4602, Semiconductor Optoelectronic Device Manufacturing and Applications; (2001) https://doi.org/10.1117/12.445732
Event: International Symposium on Optoelectonics and Microelectronics, 2001, Nanjing, China

Abstract

The mechanical reliability of electronic packaging is a topic of concern. Characterization of the thermo-mechanical behavior including the thermal stress/strain of electronic packages is critical for this topic. In this paper, current principal experimental methods used for this purpose are reviewed, their advantages and disadvantages are analyzed, also their newest applications are introduced. The hybrid method that takes the advantage of experimental methods and finite elemental method -- FEM is pointed out to be the best investigation method and represents a developing direction.

Citation Download Citation

Fei Su, Sung Yi, Fulong Dai, Huimin Xie, Mehu Vora, and Xiaoyuan He "Experimental methods for thermomechanical characterization of electronic packages: a review and evaluation", Proc. SPIE 4602, Semiconductor Optoelectronic Device Manufacturing and Applications, (16 October 2001); https://doi.org/10.1117/12.445732

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