18 June 2002 Integrated tool for fabrication of electronic components by laser direct write
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Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002); doi: 10.1117/12.470644
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States
Abstract
A prototype workstation has been developed that allows the fabrication of passive electronic components at low temperatures using a laser direct-write process. The work station combines a variety of laser processing techniques onto a single, integrated platform. These techniques include material deposition, laser micromachining, laser sintering, and laser trimming. One particular process, referred to as 'mill and fill', combines the laser micromachining ability of the tool with 'off-the-shelf' conductor pastes to allow the fabrication of high density metalization at very low temperatures. The present work describes the details of the 'mill and fill' process and shows examples of prototype devices fabricated using this technique.
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Scott A. Mathews, Chengping Zhang, Todd Kegresse, David Liu, "Integrated tool for fabrication of electronic components by laser direct write", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470644; https://doi.org/10.1117/12.470644
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KEYWORDS
Laser sintering

Silver

Polymers

Electronic components

Micromachining

Optical lithography

Laser processing

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