Laser joining of glass with silicon

Reiner Witte; Hans-Joachim Herfurth; Stefan Heinemann

doi:10.1117/12.470657

18 June 2002 Laser joining of glass with silicon

Reiner Witte, Hans-Joachim Herfurth, Stefan Heinemann

Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002) https://doi.org/10.1117/12.470657
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States

Abstract

New joining techniques are required for the variety of materials used in the manufacture of microsystems. Lasers are emerging as a useful tool for joining miniaturized devices. The beam can be focused to less than .001 inch allowing localized joining of very small geometries. There is minimal heat input into the part so distortion and change in material properties is minimal. The high quality of the laser welds and the precise process control enable hermetic sealing.

Citation Download Citation

Reiner Witte, Hans-Joachim Herfurth, and Stefan Heinemann "Laser joining of glass with silicon", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); https://doi.org/10.1117/12.470657

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