18 June 2002 Laser joining of glass with silicon
Author Affiliations +
Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002) https://doi.org/10.1117/12.470657
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States
New joining techniques are required for the variety of materials used in the manufacture of microsystems. Lasers are emerging as a useful tool for joining miniaturized devices. The beam can be focused to less than .001 inch allowing localized joining of very small geometries. There is minimal heat input into the part so distortion and change in material properties is minimal. The high quality of the laser welds and the precise process control enable hermetic sealing.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Reiner Witte, Reiner Witte, Hans-Joachim Herfurth, Hans-Joachim Herfurth, Stefan Heinemann, Stefan Heinemann, "Laser joining of glass with silicon", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470657; https://doi.org/10.1117/12.470657

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