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18 June 2002 Laser microwelding of electronic components
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Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002)
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States
This paper presents results on machine and process development for laser welding of surface mounted devices on thermal resistant polymer based molded interconnect devices with copper layers of 35 micrometers and 70 micrometers thickness. Characteristics, advantages and problems of this technology are shown and possibilities to achieve reproducible results are discussed. The investigations are carried out with pulsed Nd:YAG-lasers wit a maximum average power of 300 W. Additionally, a process control concept evaluating the reflected process radiation is discussed.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hans Kurt Toenshoff, Klaus Koerber, Christian Kulik, and K. Schafer "Laser microwelding of electronic components", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002);


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