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18 June 2002 Overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan
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Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002) https://doi.org/10.1117/12.470665
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States
Abstract
This paper presents an overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan. Various kinds of lasers and material processing technologies have been developed and applied for manufacturing electronic and photonic devices to meet the strong demands for high-performance, lightweight, low energy-consumption mobile digital consumer electronics, broadband optical fiber communications, low-emission and fuel-efficient, easy-to-steer smart cars, etc. This paper emphasizes solid-state lasers as convenient and versatile light sources for packaging advanced compact devices with sensitive passive or active components having small feature sizes. Some of the representative material processing applications using solid-state lasers for electronic and photonic devices are, opaque and clear defects repairing of LCDs, trimming of functional modules, fine-tuning of optical characteristics of photonic devices, forming of various micro-vias for high-density interconnection circuits, laser patterning of amorphous solar-cells, and high-precision laser welding of electronic components such as optical modules, miniature relays and lithium ion batteries. The recent progress in high-power ultra-short pulse solid-state lasers seems to be rapidly increasing their processing capabilities such as for fine adjustment of optical filters, etc.
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Kunihiko Washio and Hikaru Kouta "Overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); https://doi.org/10.1117/12.470665
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