18 June 2002 Processing of silicon by Nd:YAG lasers with harmonics generation
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Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002) https://doi.org/10.1117/12.470659
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States
Abstract
Micro structures in silicon are applied in different fields of industry, medicine and research. Examples are micro mechanical sensors for car security systems, nozzle plates for printer, and optical elements for x-ray beam splitting. Wherever the accuracy of etched silicon structures is not required, laser processes with short pulses and small wave length can be an option with the advantage of shorter process time. In this contribution the possibilities and limits of laser machining of Si by diode pumped Nd:YAG lasers with harmonics generation will be presented by means of structures processed by application of a scanner with f- theta-optic. The result will be discussed concerning the experimental setup and the laser parameters.
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Michael Panzner, Jorg Kasper, Hendrik Wust, Udo Klotzbach, Eckhard Beyer, "Processing of silicon by Nd:YAG lasers with harmonics generation", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470659; https://doi.org/10.1117/12.470659
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