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25 June 2002 Adhesive curing options for photonic packaging
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Proceedings Volume 4639, Optical Fiber and Fiber Component Mechanical Reliability and Testing II; (2002)
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States
Varying the intensity of illumination used to cure photoactivated adhesives has been applied in medical and dental applications to improve the performance of polymer materials. For example, it has been observed that dental polymer composite materials express reduced shrinkage, important for durability of non-amalgam restorations, by introducing a phased time-intensity cure schedule. This work identified that curing conditions could influence the final properties of materials, and suggested the possibility of extending the characteristics that could be influenced beyond shrinkage to humidity resistance, Tg, outgassing and other important material properties. Obviously, these results have important ramifications for the photonic industry, with current efforts focused on improved manufacturing techniques. Improvement in low cost packaging solutions, including adhesives, will have to be made to bring the component cost down to address the needs of Metro and similar markets. However, there are perceived problems with the widespread use of adhesives, the most prevalent of these involving long term durability of the bond. Devices are typically aligned to sub-micron precision using active feedback and then must be locked in position to maintain performance. In contrast to traditional fastening methods, adhesive bonding is a highly attractive option due to the ease of deployment, lower equipment costs, and improved flexibility. Moreover, using methods analogous to those employed in dental applications, materials properties of photonic adhesives may be tailored using a programmed cure approach.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Steven C. Martin, Manfred Hubert, and Robin Tam "Adhesive curing options for photonic packaging", Proc. SPIE 4639, Optical Fiber and Fiber Component Mechanical Reliability and Testing II, (25 June 2002);


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