25 June 2002 Modeling connector degradation
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Proceedings Volume 4639, Optical Fiber and Fiber Component Mechanical Reliability and Testing II; (2002) https://doi.org/10.1117/12.481332
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States
Abstract
In this report we analyze experimental data on the degradation of connectors that are undergoing temperature humidity cycling. The data produced to date give a strong indication that connector degradation under the high stress conditions used to date is consistent with a mechanism driven by multiple distributions of flaws in the epoxy bonds. The current model and statistical evidence are discussed, and related to some theoretical work done previously. In addition, some suggestions for further experiments are made to explore the acceleration dynamics of the mechanism.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael J. LuValle, Michael J. LuValle, Gair D. Brown, Gair D. Brown, Bruce G. LeFevre, Bruce G. LeFevre, Robert Throm, Robert Throm, } "Modeling connector degradation", Proc. SPIE 4639, Optical Fiber and Fiber Component Mechanical Reliability and Testing II, (25 June 2002); doi: 10.1117/12.481332; https://doi.org/10.1117/12.481332
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