Thermal considerations for fiber optic communication components

Peter L. Fuhr; Hsi-Hao Chung

doi:10.1117/12.469830

10 June 2002 Thermal considerations for fiber optic communication components

Peter L. Fuhr, Hsi-Hao Chung

Proceedings Volume 4647, Functional Integration of Opto-Electro-Mechanical Devices and Systems II; (2002) https://doi.org/10.1117/12.469830
Event: Symposium on Integrated Optoelectronic Devices, 2002, San Jose, California, United States

Abstract

The tight tolerances imposed on photonic components for standardized integration into DWDM systems requires that some form of temperature stabilization must be incorporated. Frequently this involves the use of traditional temperature sensors integrated into a classic control-feedback scheme involving thermo-electric coolers. While easy to implement, such a scheme is hardly novel and may result in an inefficient use of electrical power. A technique using flexible thermal tape configured into packages applicable for thermal stabilization of DWDM compliant laser diode sources and tunable filters is described.

Citation Download Citation

Peter L. Fuhr and Hsi-Hao Chung "Thermal considerations for fiber optic communication components", Proc. SPIE 4647, Functional Integration of Opto-Electro-Mechanical Devices and Systems II, (10 June 2002); https://doi.org/10.1117/12.469830

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