Paper
4 June 2002 Fabrication and performance of large (64x64) arrays of integrated VCSELs and detectors
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Abstract
Vertical-cavity surface-emitting lasers (VCSELs) are uniquely suited for applications requiring high-density 2-dimensional arrays of lasers, such as massively parallel interconnects or imaging applications. We have successfully fabricated 64x64 arrays containing alternating rows of selectively-oxidized 850 nm VCSELs and resonant-cavity photodetectors (RCPDs) on semi-insulating GaAs. In order to reduce the input/output pin count, we employed a matrix addressable architecture, where all the VCSELs (or RCPDs) in each row are connected by a common metal trace at the base of their mesas. The columns are connected by metal traces that bridge from mesa top to mesa top, connecting every other row (i.e., only VCSELs or only RCPDs). The pitch of devices in the array is 55 microns, and total resistance contributed by the long (up to 3.5 mm) row and column traces is below 50 ohms. The epitaxial design, fabrication and performance of these arrays is discussed.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kent M. Geib, Kent D. Choquette, Darwin K. Serkland, Andrew A. Allerman, and Terry W. Hargett "Fabrication and performance of large (64x64) arrays of integrated VCSELs and detectors", Proc. SPIE 4649, Vertical-Cavity Surface-Emitting Lasers VI, (4 June 2002); https://doi.org/10.1117/12.469229
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Cited by 2 scholarly publications and 1 patent.
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KEYWORDS
Vertical cavity surface emitting lasers

Metals

Etching

Sensors

Gallium arsenide

Indium gallium phosphide

Reactive ion etching

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