PROCEEDINGS VOLUME 4652
SYMPOSIUM ON INTEGRATED OPTOELECTRONIC DEVICES | 19-25 JANUARY 2002
Optoelectronic Interconnects, Integrated Circuits, and Packaging
IN THIS VOLUME

6 Sessions, 29 Papers, 0 Presentations
Section  (17)
SYMPOSIUM ON INTEGRATED OPTOELECTRONIC DEVICES
19-25 January 2002
San Jose, California, United States
Highly Integrated OEICs
Proc. SPIE 4652, VLSI microphotonics: issues, challenges, and prospects, 0000 (3 June 2002); doi: 10.1117/12.469555
Proc. SPIE 4652, Chip-scale integration of VCSEL, photodetector, and microlens arrays, 0000 (3 June 2002); doi: 10.1117/12.469564
Proc. SPIE 4652, Hybrid-integrated polarization mode converters and low-voltage electro-optic modulators using crystal-ion-sliced LiNbO3 films, 0000 (3 June 2002); doi: 10.1117/12.469572
OEICs for WDM Applications
Proc. SPIE 4652, Optoelectronic integrated circuit's (OEIC's) application in WDM, 0000 (3 June 2002); doi: 10.1117/12.469578
Proc. SPIE 4652, Properties of wavelength converters based on semiconductor optical amplifiers in the arms of a Mach-Zehnder interferometer, 0000 (3 June 2002); doi: 10.1117/12.469579
Hybrid Integration for OEICs
Proc. SPIE 4652, Optical hybrid integration using planar lightwave circuit platform, 0000 (3 June 2002); doi: 10.1117/12.469580
Proc. SPIE 4652, Optical transceiver on silicon with self-aligned laser diode, 0000 (3 June 2002); doi: 10.1117/12.469581
Proc. SPIE 4652, Hybrid-integrated optical isolators and circulators, 0000 (3 June 2002); doi: 10.1117/12.469582
OEICs for Next-Generation Optical Interconnects
Proc. SPIE 4652, Selective guided mode coupling via bridging mode by integrated gratings for intraboard optical interconnects, 0000 (3 June 2002); doi: 10.1117/12.469583
Poster Session
Proc. SPIE 4652, Design of a 622Mb/s 16-channel CMOS optical transceiver array, 0000 (3 June 2002); doi: 10.1117/12.469556
OEICs for Next-Generation Optical Interconnects
Proc. SPIE 4652, Optimized cladding materials for nonlinear-optic polymer-based devices, 0000 (3 June 2002); doi: 10.1117/12.469557
Section
Proc. SPIE 4652, Automating the laser diode attach process, 0000 (3 June 2002); doi: 10.1117/12.469558
Proc. SPIE 4652, Through wafer via hole by reactive ion etching of GaAs, 0000 (3 June 2002); doi: 10.1117/12.469559
Proc. SPIE 4652, Welding-induced alignment distortion in DIP LD packages: effect of laser welding sequence, 0000 (3 June 2002); doi: 10.1117/12.469560
Proc. SPIE 4652, Microjet printing of high-precision microlens array for packaging of fiber optic components, 0000 (3 June 2002); doi: 10.1117/12.469561
Proc. SPIE 4652, Use of glass solder in fixing an optical fiber in a laser package, 0000 (3 June 2002); doi: 10.1117/12.469562
Proc. SPIE 4652, Heat shielding of temperature-sensitive optical waveguide components, 0000 (3 June 2002); doi: 10.1117/12.469563
Proc. SPIE 4652, Silicon microlens surface mounted on a v-groove for low-cost optical modules, 0000 (3 June 2002); doi: 10.1117/12.469565
Proc. SPIE 4652, Optical assembly of collimator arrays for MEMS applications, 0000 (3 June 2002); doi: 10.1117/12.469566
Proc. SPIE 4652, Telecommunication fiber OPA analysis, project, and characterization, 0000 (3 June 2002); doi: 10.1117/12.469567
Proc. SPIE 4652, Emerging technologies for chip-level optical interconnects, 0000 (3 June 2002); doi: 10.1117/12.469568
Proc. SPIE 4652, Cantilever microscanners for free-space optical interconnects, 0000 (3 June 2002); doi: 10.1117/12.469569
Proc. SPIE 4652, 40-Gb/s 4 x 10 array VCSEL driver in 0.35-mm CMOS technology, 0000 (3 June 2002); doi: 10.1117/12.469570
Proc. SPIE 4652, Substrate-guided-wave hologram-based continuously variable true-time-delay module for microwave phased-array antennas, 0000 (3 June 2002); doi: 10.1117/12.469571
Proc. SPIE 4652, Compact multi/demultiplexer system consist of stacked dielectric interference filters and aspheric lenses, 0000 (3 June 2002); doi: 10.1117/12.469573
Proc. SPIE 4652, Widely tunable laser technologies: meeting the needs of tomorrow's networks, 0000 (3 June 2002); doi: 10.1117/12.469574
Proc. SPIE 4652, CWDM for very-short-reach and optical-backplane interconnections, 0000 (3 June 2002); doi: 10.1117/12.469575
OEICs for WDM Applications
Proc. SPIE 4652, Effect of noise on the performance of optical 3R regeneration, 0000 (3 June 2002); doi: 10.1117/12.469576
Section
Proc. SPIE 4652, Multichannel free-space intrachip optical interconnections: combining plastic micro-optical modules and VCSEL-based OE-FPGA, 0000 (3 June 2002); doi: 10.1117/12.469577
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