3 June 2002 Chip-scale integration of VCSEL, photodetector, and microlens arrays
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Proceedings Volume 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging; (2002); doi: 10.1117/12.469564
Event: Symposium on Integrated Optoelectronic Devices, 2002, San Jose, California, United States
Abstract
New generations of network application continue to demand component solutions of higher speed (10 Gbps and beyond) with good reliability and affordability. The potential of VCSEL arrays technology in meeting those demands has long been recognized and is being actively explored by many in the field. In this paper we present a few examples of VCSEL array based technology developments including monolithic integration of VCSELs and photodetector (PD) in both 1D and 2D arrays, and their hybrid integration with micro-lens array and electronic integrated circuits for optical interconnects. As we explore to achieve more functionality through integration, we also emphasize on the merits of usability of the electrical and optical interfaces of the new components, and producibility and manufacturability aspects of the new technologies.
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Yue Liu, Klein Johnson, Mary K. Hibbs-Brenner, "Chip-scale integration of VCSEL, photodetector, and microlens arrays", Proc. SPIE 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging, (3 June 2002); doi: 10.1117/12.469564; https://doi.org/10.1117/12.469564
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KEYWORDS
Vertical cavity surface emitting lasers

Interfaces

Microlens array

Semiconducting wafers

Integrated optics

Microlens

Free space optics

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