3 June 2002 Optical assembly of collimator arrays for MEMS applications
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Proceedings Volume 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging; (2002) https://doi.org/10.1117/12.469566
Event: Symposium on Integrated Optoelectronic Devices, 2002, San Jose, California, United States
Abstract
In the collimator array development effort for MEMS applications, the ability to align devices automatically that meets industry target specifications of power throughput for multiple channels has been demonstrated. Results show eight-channel devices have been successfully aligned and attached within 2-dB power loss. Three key factors of success include: (1) Automated Pitch/Yaw using virtual pivot, (2) initial mirror alignment to verify parallelism between fiber array and lens array, (3) channel balance algorithm to compensate for lens array pitch and focal length variations.
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Nina Zhang, Nina Zhang, Frank Vodhanel, Frank Vodhanel, Martin Hagenbuechle, Martin Hagenbuechle, } "Optical assembly of collimator arrays for MEMS applications", Proc. SPIE 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging, (3 June 2002); doi: 10.1117/12.469566; https://doi.org/10.1117/12.469566
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