Paper
3 June 2002 Optical transceiver on silicon with self-aligned laser diode
Hans Joachim Heider, Stefan Wiechmann, Matthias Mahnke, Joerg Mueller
Author Affiliations +
Abstract
An optical transceiver is presented consisting of a polarization insensitive directional coupler, a hybrid integrated self-aligned laser diode and a hybrid integrated photodiode. In order to increase waveguide-fiber coupling, the fiber is connected to a tapered waveguide. The polarization insensitive directional coupler is designed for separation of the transmitting ((lambda) equals1.3 micrometers ) and the receiving ((lambda) equals1.55 micrometers ) wavelengths. The coupler is based on Al2O3 waveguides realized by MOPECVD processes. These waveguides show attenuation below 0.3 dB/cm at the wavelengths of interest after annealing at ~700 degree(s)C. The hybrid integration of the laser diode is realized by a self-aligned soldering process. Electroplated tin/gold is used as the solder, while the pre-positioning of the laser diode is achieved by a fine-placer. After self-alignment, the misalignment of the laser has to be smaller than +/- 0.5 micrometers vertical and +/- 1.5 micrometers lateral to achieve coupling losses below 3 dB. Vertical mirrors are used for guiding the signal on the chip to reduce optical losses and chip size. The waveguide-fiber coupling is optimized by a tapered waveguide during the deposition of the Al2O3 layer by a KOH-etched silicon mask. The lateral positioning of the fiber is guaranteed by the vertically etched walls of the waveguide improving the properties of the coupling facet. The depth of the fiber groove is machined by an isotropic silicon plasma etch process.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hans Joachim Heider, Stefan Wiechmann, Matthias Mahnke, and Joerg Mueller "Optical transceiver on silicon with self-aligned laser diode", Proc. SPIE 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging, (3 June 2002); https://doi.org/10.1117/12.469581
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CITATIONS
Cited by 2 scholarly publications and 1 patent.
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KEYWORDS
Waveguides

Transceivers

Aluminum

Mirrors

Silicon

Semiconductor lasers

Integrated optics

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