8 March 2002 Novel technique for microscopic imaging (quality control) of silicon wafers
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Abstract
We propose and experimentally demonstrate a fluorescent imaging technique for surface quality control of wet-cleaned silicon wafers. This simple technique allows macro- and microscopic imaging. Submicron resolution and fast scanning are successfully demonstrated. Distribution of water stains is measured using this novel technique and correlated to the surface structure.
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Vladislav V. Yakovlev, Vladislav V. Yakovlev, Katerina Mikhailchenko, Katerina Mikhailchenko, Michael Ravkin, Michael Ravkin, } "Novel technique for microscopic imaging (quality control) of silicon wafers", Proc. SPIE 4664, Machine Vision Applications in Industrial Inspection X, (8 March 2002); doi: 10.1117/12.460188; https://doi.org/10.1117/12.460188
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