1 July 2002 Low-temperature wafer-scale warm embossing for mix and match with UV lithography
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Proceedings Volume 4688, Emerging Lithographic Technologies VI; (2002); doi: 10.1117/12.472295
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States
The combination of nanoimprint and UV-lithography has been demonstrated. For this purpose a UV-sensitive epoxy based resin with a low glass temperature was prepared by adding low molecular weight components, in particular by increasing the monomer content. The suitability of our approach to minimize process temperatures was tested by embossing and VU-lithography. Mix and match of both techniques was used to demonstrate that the embossing step did not degrade the UV sensitivity of the material. UV processing provided in addition a simple means for stabilization of this low Tg material. Resists like mr-L 6000-1 xp may close the gap between 'hot embossing' 'UV-molding' and UV-lithography.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hubert Schulz, Matthias Wissen, Nils Roos, Hella-Christin Scheer, Karl Pfeiffer, Gabi Gruetzner, "Low-temperature wafer-scale warm embossing for mix and match with UV lithography", Proc. SPIE 4688, Emerging Lithographic Technologies VI, (1 July 2002); doi: 10.1117/12.472295; https://doi.org/10.1117/12.472295

Ultraviolet radiation



Semiconducting wafers


Scanning electron microscopy

Nanoimprint lithography

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