16 July 2002 Defect printability analysis study using virtual stepper system in a production environment
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In this paper the simulation of wafer images for Attenuated Phase Shift Masks (ATTPSM) and repaired binary masks are performed by Virtual Stepper System in a real production environment. In addition, the Automatic Defect Severity Scoring module in Virtual Stepper is also used to calculate the defect severity score for each defect. ADSS provides an overall score that quantifies the impact of a given defect on the surrounding features. For the binary masks, the quality of reported defects is studied. For the ATTPSM three types of programmed defects on both line/space and contact hole patterns are assessed. Wafer exposures are performed using 248 nm imaging technology and inspection images generated on a KLA-Tencor's SLF27 system. These images are used by the Virtual Stepper System to simulate wafer images under the specific stepper parameters. The result are compared to SEM images of resist patterns and Aerial Image Measurement System simulated results.
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Shao-Yung Chiou, Shao-Yung Chiou, Henrry Lei, Henrry Lei, WeiJyh Liu, WeiJyh Liu, M. J. Chu, M. J. Chu, Daryl Chiang, Daryl Chiang, Steve Tuan, Steve Tuan, Chia-Lung Hong, Chia-Lung Hong, Michael Chang, Michael Chang, Jiunn-Hung Chen, Jiunn-Hung Chen, Kevin K. Chan, Kevin K. Chan, Qi-De Qian, Qi-De Qian, Lynn Cai, Lynn Cai, Linyong Pang, Linyong Pang, } "Defect printability analysis study using virtual stepper system in a production environment", Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); doi: 10.1117/12.473465; https://doi.org/10.1117/12.473465

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