24 July 2002 Ultra-thick lithography for advanced packaging and MEMS
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An ever increasing need exists for thick resist layers in the processing of MEMS and for advanced packaging. Applications in the MEMS field include bulk micromachining, surface micromachining, and the actual creating of active device structures. For advanced packaging, the applications are in redistribution and passivation layers, and micromolds for metal bumps. The various applications can require resist layer thicknesses up to and exceeding 1000 micrometers . In order to properly achieve these thicknesses, appropriate coating materials were developed by manufacturers. These materials include AZ P4620, Shipley SPR220, AZ PLP100XT, JSR THB 611P, and SU-8. Finally, equipment was developed to handle these materials, in the form of specialized coating equipment and contact/proximity aligners.
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Chad Brubaker, Chad Brubaker, Rafiqul Islam, Rafiqul Islam, Helge Luesebrink, Helge Luesebrink, } "Ultra-thick lithography for advanced packaging and MEMS", Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); doi: 10.1117/12.474225; https://doi.org/10.1117/12.474225

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