Challenges in high NA, polarization, and photoresists

Bruce W. Smith; Julian S. Cashmore

doi:10.1117/12.474562

30 July 2002 Challenges in high NA, polarization, and photoresists

Bruce W. Smith, Julian S. Cashmore

Proceedings Volume 4691, Optical Microlithography XV; (2002) https://doi.org/10.1117/12.474562
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

Optical lithography is being pushed into a regime of extreme-numerical aperture (extreme-NA). The implications of the nonscalar effects of high-NA lithography (above 0.50) have been discussed now for many years. This paper considers the consequences of imaging at numerical apertures above 0.70 with the oblique imaging angles required for low k₁ lithography. A new scaling factor, k_NA, is introduced to capture the impact of low k₁ imaging combined with extreme-NA optics. Extreme-imaging is defined as k₁ and k_NA values approach 0.25. Polarization effects combined with resist requirements for extreme-NA are addressed, especially as they relate to 157 nm lithography. As these technologies are pursued, careful consideration of optical and resist parameters is needed. Conventional targets for resist index, absorption, diffusion, and reflectivity based on normal incidence imaging may not lead to optimum performance without these considerations. Additionally, methods of local and semi-local mask polarization are discussed using concepts of wire-grid polarizer arrays. Back-side and image-side polarization OPC methods are introduced.

Citation Download Citation

Bruce W. Smith and Julian S. Cashmore "Challenges in high NA, polarization, and photoresists", Proc. SPIE 4691, Optical Microlithography XV, (30 July 2002); https://doi.org/10.1117/12.474562

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