30 July 2002 Development of environmental control technologies for 157-nm lithography at ASET
Author Affiliations +
Purging and reduction of out-gassing are very important issues that need to be treated in order to realize F2 laser lithography system. Several methods of purging are tried and out-gases from metals, O-rings, lubricants, and an adhesive are analyzed. Metal surfaces mainly release oxygen and water independent of surface roughness, Ni plating, or elements. Other substances are not detected by API-MS or GC-MS. Since O-rings are indispensable to make gas-tight structures, several kinds of O-rings made of fluoro-compounds are tested. Black fluoro-rubber o-ring, O-ring F, is recommended from the view of organic out-gassing but Teflon-based fluoro-elastomer, O-ring A, is a good candidate in terms of the water out-gassing. Greases emit a large amount of out-gases even when the samples are not irradiated by 157 nm laser. As an adhesive, Adhesive A is recommended because of the fact that it does not release as much organic and inorganic compounds which may absorb 157 nm laser light. Finally preliminary demonstration using a model exposure system is performed to obtain purging time for several cases.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yasuaki Fukuda, Yasuaki Fukuda, Seiji Takeuchi, Seiji Takeuchi, Takashi Aoki, Takashi Aoki, Hiroyuki Nagasaka, Hiroyuki Nagasaka, Soichi Owa, Soichi Owa, Fumika Yoshida, Fumika Yoshida, Youichi Kawasa, Youichi Kawasa, Keiji Egawa, Keiji Egawa, Takehito Watanabe, Takehito Watanabe, Ikuo Uchino, Ikuo Uchino, Akira Sumitani, Akira Sumitani, Kiyoharu Nakao, Kiyoharu Nakao, } "Development of environmental control technologies for 157-nm lithography at ASET", Proc. SPIE 4691, Optical Microlithography XV, (30 July 2002); doi: 10.1117/12.474622; https://doi.org/10.1117/12.474622

Back to Top