30 July 2002 Innovative optical alignment technique for CMP wafers
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Detecting position of the wafers such as after CMP process is critical theme of current and forthcoming IC manufacturing. The alignment system must be with high accuracy for any process. To satisfy such requirements, we have studied and analyzed factors that have made alignment difficult. From the result of the studies, we have developed new optical alignment techniques which improve the accuracy of FIA (alignment sensor of Nikon's NSR series) and examined them. The approaches are optimizing the focus position, developing an advanced algorithm for position detection, and selecting a suitable mark design. For experiment, we have developed the special wafers that make it possible to evaluate the influence of CMP processes. The experimental results show that the overlay errors decrease dramatically with the new alignment techniques. FIA with these new techniques will be much accurate and suitable alignment sensor for CMP and other processes of future generation ULSI production.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ayako Sugaya, Yuho Kanaya, Shinichi Nakajima, Tadashi Nagayama, Naomasa Shiraishi, "Innovative optical alignment technique for CMP wafers", Proc. SPIE 4691, Optical Microlithography XV, (30 July 2002); doi: 10.1117/12.474475; https://doi.org/10.1117/12.474475


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