30 July 2002 Self-calibration of wafer scanners using an aerial image sensor
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Abstract
To improve both the versatility and stability of leading edge wafer scanners, the functionality of an integrated aerial image sensor has been expanded. The system performance of current wafer scanners is a strong function of the quality of image formation of the projection lens. Current wafer scanners use aerial image sensors for best image plane calibration, illumination telecentricity calibration, coma aberration calibration, and distortion calibration. The aerial image sensor is used not only for a scanner's self-calibration but also during the projection lens manufacturing purposes. The slit-scan type aerial image sensor is used for measurement of the intensity distribution of the aerial images. This type of the image sensor can detect the intensity distribution of the aerial image from 110nm L/ S to 6micrometers L/ S. Therefore this aerial image sensor covers most aerial image measurement requirements. In this paper we will focus on the aerial image measurement for self-calibration purposes and their actual performances. We evaluate the actual performance of illumination telecentricity and coma aberration measurement. Evaluation is based upon not only measurement repeatability but also its agreement with resist image measurement results.
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Tsuneyuki Hagiwara, Tsuneyuki Hagiwara, Masato Hamatani, Masato Hamatani, Naoto Kondo, Naoto Kondo, Kosuke Suzuki, Kosuke Suzuki, Hisashi Nishinaga, Hisashi Nishinaga, Jiro Inoue, Jiro Inoue, Koji Kaneko, Koji Kaneko, Shunichi Higashibata, Shunichi Higashibata, "Self-calibration of wafer scanners using an aerial image sensor", Proc. SPIE 4691, Optical Microlithography XV, (30 July 2002); doi: 10.1117/12.474637; https://doi.org/10.1117/12.474637
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