Layouts and RETs
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Prediction of light scattering from particles on a filmed surface using discrete-dipole approximation
Defect detection for short-loop process and SRAM-cell optimization by using addressable failure site-test structures (AFS-TS)
Developing an integrated imaging system for the 70-nm node using high numerical aperture ArF lithography
New method for reducing across-chip poly-CD variation with statistical OPC/gauge capability analysis
Monte-Carlo methods for chemical-mechanical planarization on multiple-layer and dual-material models
Investigation of the physical and practical limits of dense-only phase-shift lithography for circuit feature definition
Development of a sub-100nm integrated imaging system using chromeless phase-shifting imaging with very high NA KrF exposure and off-axis illumination
Panel discussion summary: do we need a revolution in design and process integration to enable sub-100-nm technology nodes?