12 July 2002 Microloading characterization of 300-mm etch and CMP tools
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Abstract
An investigation of the microloading effects form the 300mm wafer Etch and CMP polish processes was done at SC300, a joint venture between Motorola and Infineon Technologies for 300mm wafer, process and equipment development in Dresden, Germany. Test wafers were constructed to approximate the structural features of DRAM and microprocessors devices, and standard or scaled-up processes were run to identify potential limitations and defects. Oxide dielectric etch and CMP process instability and microloading effects are know n to cause significant device yield loss.
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Karl E. Mautz, Karl E. Mautz, "Microloading characterization of 300-mm etch and CMP tools", Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); doi: 10.1117/12.475653; https://doi.org/10.1117/12.475653
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