12 July 2002 New method for reducing across-chip poly-CD variation with statistical OPC/gauge capability analysis
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Abstract
In this paper, we propose a new analysis method to quantify the performance of optical proximity effect correction (OPC) as well as the gauge capability of in-process quality control (IPQC) monitors. The method consists of two stages. The first stage is to quantify the gauge capability of IPQC monitor patters for representing 'across chip line width variation' (ACLV). The second one is to verify OPC by using the IPQC monitor patterns as verified in the first stage. Our new analysis method has bene found to be remarkably effective and quite useful to optimize OPC parameters and other methods in attempting to reduce ACLV, the most critical factor in producing high-end logic devices with a design rule of 0.15 micrometers and below.
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Hidetoshi Ohnuma, Hidetoshi Ohnuma, Koji Kikuchi, Koji Kikuchi, Hiroichi Kawahira, Hiroichi Kawahira, } "New method for reducing across-chip poly-CD variation with statistical OPC/gauge capability analysis", Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); doi: 10.1117/12.475672; https://doi.org/10.1117/12.475672
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