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12 July 2002 Nondestructive testing of damage layers in semiconductor materials by surface acoustic waves
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Abstract
Slicing semi-conductor wafers form ingots produces a damage layer that ha to be completely removed by complex polishing and etching processes. Nondestructively controlling the machining process is desirable. Laser induced surface acoustic waves are demonstrated to be a promising method to characterize the state of the surface.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dieter Schneider, Eva Stiehl, Ralf Hammer, Andreas Franke, Richard P. Riegert, and Thomas Schuelke "Nondestructive testing of damage layers in semiconductor materials by surface acoustic waves", Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); https://doi.org/10.1117/12.475660
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