11 July 2002 Novel technique for fabrication of multi-layered microcoils in microelectromechanical systems (MEMS) applications
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Abstract
A novel planarization technique, compressive molding planarization (CMP) is developed for implementation of a multi-layered micro coil device. Applying CMP and other micromachining techniques, a multi-layered micro coil device has been designed and fabricated, and its use in the magnetic micro actuators for hard disk drive applications has been demonstrated, showing that it can produce milli-Newton of magnetic force suitable for driving a micro actuator. The novel CMP technique can be equally applicable in other MEMS devices fabrication to ease the process integration for the complicated structure.
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Hung-Pin Chang, Jiangyuan Qian, Mark Bachman, Philip Congdon, Guann-pyng Li, "Novel technique for fabrication of multi-layered microcoils in microelectromechanical systems (MEMS) applications", Proc. SPIE 4700, Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology, (11 July 2002); doi: 10.1117/12.475030; https://doi.org/10.1117/12.475030
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