Characterization Techniques For X-Ray Lithography Submicron Metrology

S. A Harrell; D. Alexander

doi:10.1117/12.942335

18 June 1984 Characterization Techniques For X-Ray Lithography Submicron Metrology

S. A Harrell, D. Alexander

Proceedings Volume 0471, Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies III; (1984) https://doi.org/10.1117/12.942335
Event: 1984 Microlithography Conferences, 1984, Santa Clara, United States

Abstract

An electrical test structure and a methodology are proposed for equipment, process, and method characterization for submicron lithographic VLSI applications. An integrated approach of electrical test structures, optical test structures with manual or automatic optical inspection methods is described.

Citation Download Citation

S. A Harrell and D. Alexander "Characterization Techniques For X-Ray Lithography Submicron Metrology", Proc. SPIE 0471, Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies III, (18 June 1984); https://doi.org/10.1117/12.942335

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