18 June 1984 Dc Electroplating Of Sub-Micron Gold Patterns On X-Ray Masks
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Abstract
Current Bell Laboratories X-ray mask absorber pattern transfer technology consists of sputter-etching a 6000 - 7000A thick gold metallization using a 800A thin tantalum etch mask, resulting in features with a 70° wall slope. Since X-ray absorption is exponential with thickness, the resist under the sloped portion of the abosorber will receive various degrees of exposure. Therefore, as X-ray lithography approaches sub-micron dimensions, gold absorber walls must be made vertical in order to provide better resolution and linewidth control. We describe a method for obtaining vertical wall sub-micron gold patterns on X-ray masks by DC gold electroplating into a reactive ion etched trilevel stencil over a 200A gold plating base. A commercial gold sulphite solution is used in a fountain system to gold plate into the trilevel stencil. Gold features as small as 1000A wide and 1pm high have been obtained. The minimum gold feature size appears to be limited by stencil formation. Electroplated gold film stress, microstructure and thickness uniformity are within the prescribed limits for the manufacture of X-ray masks.
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G. E. Georgiou, G. E. Georgiou, C A Jankoski, C A Jankoski, T A. Palumbo, T A. Palumbo, } "Dc Electroplating Of Sub-Micron Gold Patterns On X-Ray Masks", Proc. SPIE 0471, Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies III, (18 June 1984); doi: 10.1117/12.942333; https://doi.org/10.1117/12.942333
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