Paper
15 March 2002 Quantitative thermal nondestructive evaluation using an uncooled microbolometer infrared camera
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Abstract
Recent advances in uncooled microbolometer detector arrays has resulted in low cost, small size/weight, and low power consumption infrared cameras. The purpose of this paper is to assess the capabilities of the new microbolometer infrared cameras for quantitative thermal nondestructive evaluation. The camera assessed is a 160 x 128 uncooled microbolometer sensor array operating in the long wavelength infrared band (7.5 to 13.5 microns). The camera size is 4.32 H x 4.32 W X 10.92 L centimeters. Quantitative thermal diffusivity and thickness images obtained by minimizing the squared difference between the data and a thermal model on samples with fabricated defects are presented. The results are compared to conventional thermal imaging cameras using cooled focal plane array detectors. The advantages of a synchronized electronic shutter system (SESS) to remove the heat lamp influence during and after flash heating will also be discussed for these uncooled microbolometer detector arrays.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joseph N. Zalameda and William P. Winfree "Quantitative thermal nondestructive evaluation using an uncooled microbolometer infrared camera", Proc. SPIE 4710, Thermosense XXIV, (15 March 2002); https://doi.org/10.1117/12.459614
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Cited by 5 scholarly publications.
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KEYWORDS
Microbolometers

Infrared cameras

Cameras

Thermal effects

Lamps

Camera shutters

Sensors

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