5 August 2002 Advanced imaging sensors at Rockwell Scientific Company
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Abstract
The past 2 to 3 years has been a period of explosive growth in technology development for imaging sensors at Rockwell Scientific Co. (RSC). The state of the art has been advanced significantly, resulting in a number of unique advanced imaging sensor products. A few key examples are: 2048 x 2048 sensor chip assemblies (SCA) for ground and space-based applications, 4096 x 4096 mosaic close-butted mosaic FPA assemblies, a very high performance 10 x 1024 hybridized linear SCA for optical network monitoring and other applications, the revolutionary CMOS ProCam-HD imaging system-on-a-chip for high definition television (HDTV), and RSC's near-infrared emission microscope camera for VLSI defect detection/analysis. This paper provides selected updates of these products and thereby provides an overview of the ongoing highly fertile period of technology and product development at Rockwell Scientific. A view into future directions for advanced imaging sensors is also provided.
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John T. Montroy, John T. Montroy, James D. Garnett, James D. Garnett, Scott A. Cabelli, Scott A. Cabelli, Markus Loose, Markus Loose, Atul B. Joshi, Atul B. Joshi, Gary W. Hughes, Gary W. Hughes, Lester J. Kozlowski, Lester J. Kozlowski, Allan K. Haas, Allan K. Haas, Selmer S. Wong, Selmer S. Wong, Majid Zandian, Majid Zandian, Annie Chi-yi Chen, Annie Chi-yi Chen, John G. Pasko, John G. Pasko, Mark C. Farris, Mark C. Farris, Craig A. Cabelli, Craig A. Cabelli, Donald E. Cooper, Donald E. Cooper, Jose M. Arias, Jose M. Arias, Jagmohan Bajaj, Jagmohan Bajaj, Kadri Vural, Kadri Vural, } "Advanced imaging sensors at Rockwell Scientific Company", Proc. SPIE 4721, Infrared Detectors and Focal Plane Arrays VII, (5 August 2002); doi: 10.1117/12.478849; https://doi.org/10.1117/12.478849
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