5 August 2002 Room temperature YBaCuO infrared detectors on a flexible substrate
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Proceedings Volume 4721, Infrared Detectors and Focal Plane Arrays VII; (2002); doi: 10.1117/12.478856
Event: AeroSense 2002, 2002, Orlando, FL, United States
Abstract
Infrared microbolometer thermal detectors have been fabricated on a flexible substrate, a polyimide that shows very similar characteristics to Kapton , when cured. The polyimide is spin-coated on a regular Si wafer with a release layer. Low temperature fabrication techniques are employed to minimize the thermal cycling of the polyimide substrate as well as to maintain compatibility with CMOS circuitry. Infrared microsensors on flexible substrates showed a Temperature Coefficient of Resistance (TCR=(1/R)(dR/dT)) of -3.03%, at room temperature. The microbolometers reached the responsivity and detectivity of 3.5x103 V/W and 1x107 cm.Hz1/2 /W, respectively, at 2.88 μA of current bias even though at this time no micromachining has been performed. Some devices were encapsulated between polyimide layers in order to provide protection and passivation. These bolometers demonstrated a responsivity and detectivity of 1.6x103 V/W and 4.9x106 cm.Hz1/2/W, respectively at 1 μA of current bias. This is the first attempt towards a smart skin that incorporates flexible microsensors on a cured polyimide-substrate.
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Zeynep Celik-Butler, Donald P. Butler, Ali Yildiz, "Room temperature YBaCuO infrared detectors on a flexible substrate", Proc. SPIE 4721, Infrared Detectors and Focal Plane Arrays VII, (5 August 2002); doi: 10.1117/12.478856; https://doi.org/10.1117/12.478856
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KEYWORDS
Silicon

Microbolometers

Resistance

Sensors

Semiconducting wafers

Bolometers

Infrared detectors

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