1 August 2002 Experimental and numerical studies of the effects of materials and attachment conditions on pellicle induced distortions in advanced photomasks
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Proceedings Volume 4754, Photomask and Next-Generation Lithography Mask Technology IX; (2002) https://doi.org/10.1117/12.476972
Event: Photomask and Next Generation Lithography Mask Technology IX, 2002, Yokohama, Japan
Abstract
Lithography registration errors induced by the attachment of soft pellicles on reticles can significantly affect wafer overlay performance for sub-100 nm lithography chip manufacturing. Intel Corporation and the University of Wisconsin have conducted an extensive study to identify the various sources of pellicle-induced distortions and methods for error reduction in order to meet advanced mask manufacturing requirements. In this study, pellicle attachment processes and system materials were evaluated to determine the effects on image placement accuracy. In particular, the in-plane distortions due to the pellicle attachment technique, pellicle frame flatness, frame adhesive, and environmental temperature were characterized. At Intel, pellicles were attached to a test reticle with a 21 X 21 array of grid points. Registration measurements were conducted before and after pellicle attachment using an optical distance metrology system. A comprehensive finite element model was developed at the University of Wisconsin to assess the contributions to pellicle-induced distortions from individual components of the pellicle system. Pellicle frame flatness, frame adhesive, and temperatures were measured and used as input to the finite element model. The correlation between simulation results and experimental data was excellent. Analyses were also performed to study pellicle mounting mechanisms and pellicle frame flatness.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Eric P. Cotte, Eric P. Cotte, Roxann L. Engelstad, Roxann L. Engelstad, Edward G. Lovell, Edward G. Lovell, Daniel Tanzil, Daniel Tanzil, Florence O. Eschbach, Florence O. Eschbach, Emily Y. Shu, Emily Y. Shu, } "Experimental and numerical studies of the effects of materials and attachment conditions on pellicle induced distortions in advanced photomasks", Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); doi: 10.1117/12.476972; https://doi.org/10.1117/12.476972
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