1 August 2002 Flexible mask specifications
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Proceedings Volume 4754, Photomask and Next-Generation Lithography Mask Technology IX; (2002) https://doi.org/10.1117/12.477004
Event: Photomask and Next Generation Lithography Mask Technology IX, 2002, Yokohama, Japan
Abstract
A methodology for specifying mask quality named flexible mask specifications is proposed. The methodology consists of two major concepts. One is flexibly selected patterns to guarantee mask quality for each device and each level of devices using full-chip level lithography simulation. The other is flexibly changeable combination of each tolerance for each error component. The validity of flexible mask specifications is proved on masks of a 130nm node memory device. Using the flexible mask specifications, we have confirmed that mask manufacturing yield rise up by 20 percent on masks of a 175nm node memory device compared with the yield of the masks judged by conventional mask specifications.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shigeki Nojima, Shigeki Nojima, Shoji Mimotogi, Shoji Mimotogi, Masamitsu Itoh, Masamitsu Itoh, Osamu Ikenaga, Osamu Ikenaga, Shigeru Hasebe, Shigeru Hasebe, Kohji Hashimoto, Kohji Hashimoto, Soichi Inoue, Soichi Inoue, Mineo Goto, Mineo Goto, Ichiro Mori, Ichiro Mori, } "Flexible mask specifications", Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); doi: 10.1117/12.477004; https://doi.org/10.1117/12.477004
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