1 August 2002 High-performance DUV inspection system for 100-nm generation masks
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Proceedings Volume 4754, Photomask and Next-Generation Lithography Mask Technology IX; (2002) https://doi.org/10.1117/12.476961
Event: Photomask and Next Generation Lithography Mask Technology IX, 2002, Yokohama, Japan
Mask inspection has become a much more important factor in LSI manufacturing. In order to perform mask inspection with high reliability for devices of 100-130 nm rule and below, a high-resolution and high-speed die-to-database inspection system is indispensable. In order to satisfy these requirements, the Toshiba MC-3500, a next-generation mask inspection system using 257nm DUV short wavelength optics, has been developed. The MC-3500 employs a die-to-database comparison method and a high-performance data processing system that is newly developed. This paper reports the system configuration, basic characteristics for defect detection and inspection performance.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hideo Tsuchiya, Hideo Tsuchiya, Ikunao Isomura, Ikunao Isomura, Kazuhiro Nakashima, Kazuhiro Nakashima, Kyoji Yamashita, Kyoji Yamashita, Toshiyuki Watanabe, Toshiyuki Watanabe, Takeshi Nishizaka, Takeshi Nishizaka, Hiroyuki Ikeda, Hiroyuki Ikeda, Eiji Sawa, Eiji Sawa, Masami Ikeda, Masami Ikeda, "High-performance DUV inspection system for 100-nm generation masks", Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); doi: 10.1117/12.476961; https://doi.org/10.1117/12.476961

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