19 April 2002 Efforts in developing design and simulation tools for MEMS: DS/MEMS and CA/MEMS
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Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462821
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France
Abstract
In this work, multi-physics simulation software (CA/MEMS) and design-optimization software (DS/MEMS) tailored for MEMS devices are introduced. The CA/MEMS, which is a simulation engine for DS/MEMS, is a 3-D multi-physics analysis code utilizing various numerical methods such as FEM, BEM and FVM to efficiently model MEMS application problems. The current CA/MEMS includes analysis- modules for structural, thermal, electric, electromagnetic and fluidic fields and is capable of the analyses of various coupled- field problems for MEMS applications. DS/MEMS is design optimization engine for MEMS devices. With integrating CA/MEMS and pre/post processor into CAD environment, DS/MEMS is organized to work in parametric CAD platform. DS/MEMS consists of optimal design module and robust design module. The optimal design module provides users three methods nonlinear programming, Taguchi parameter design and the response surface method. The robust design module, which is specially developed for MEMS application, can be used to minimize the perturbation of performances of MEMS devices under uncertainties of MEMS devices, such as process tolerance and the change of operating environments. To verify the efficiency and accuracy of CA/MEMS and the practical usefulness of DS/MEMS, we have been comparing the simulated results of CA/MEMS with those of other commercial codes and experimental data of manufactured MEMS devices, and investigating the performances of the optimized designs through DS/MEMS.
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Sung Kie Youn, Byung Man Kwak, Jang-Hyuk Kwon, Su-Young Chang, Jae Sung Huh, Eugene Kim, "Efforts in developing design and simulation tools for MEMS: DS/MEMS and CA/MEMS", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462821; https://doi.org/10.1117/12.462821
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