19 April 2002 Example of simultaneous alignment, packaging, and interconnection of MEMS stacks
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Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462871
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France
Abstract
Packaging and electrical interconnection are an important part of the fabrication path of MEMS and MOEMS. This article shows one example for alignment, packaging and interconnection using anodic bonding in combination with vertical v-grooves for precise mechanical alignment. Stacks of twelve alternating layers of borosilicate glass and silicon have been fabricated with an alignment accuracy of better than +/21.5micrometers . Furthermore, a new anodic bonding method is presented that avoids any sodium compound formation at critical areas of a device.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Harold S. Gross, Harold S. Gross, Dinh Ton, Dinh Ton, M. Gmuer, M. Gmuer, David A. Crewe, David A. Crewe, } "Example of simultaneous alignment, packaging, and interconnection of MEMS stacks", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462871; https://doi.org/10.1117/12.462871
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