19 April 2002 In-situ sensors for product reliability monitoring
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Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462807
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France
Abstract
Some advantages of predicting reliability include providing advance warning signs of failure, and the reduction of life cycle costs by reducing inspection and unscheduled maintenance. However, predictions can be inaccurate if they do not account for the actual environments that the product is subjected to in its li8fe cycle. This paper describes an in-situ sensor (prognostic monitor) approach, which can be used to estimate the accumulated damage and the remaining life of semiconductor devices.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Satchidananda Mishra, Michael Pecht, Douglas L. Goodman, "In-situ sensors for product reliability monitoring", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462807; https://doi.org/10.1117/12.462807
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