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19 April 2002 Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems
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Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462840
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France
Abstract
The paper presents an algorithm for the thermal simulation of MEMS problems for the cases when certain parts of the MEMS structure are given with their detailed structural description while others are given with the RC network compact models. The presented co-siumulation algorithm enables fast simulation in the frequency or in the time domain, and can be a very useful extension of any kind of field solvers. The thermal simulation of a hot-plate problem demonstrates the advantages and the simpli8city of the method.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Marta Rencz, Vladimir Szekely, and Andras Poppe "Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462840
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