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19 April 2002 Micro/nano-DAC deformation measurement to analyze packaging components response to thermomechanical load
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Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462878
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France
Abstract
Thermo-mechanical reliability in advanced electronic, MEMS and MOEMS packaging requires additional material testing approaches. Namely, the necessary understanding of the impact of very local material stressing on component reliability leads to the need of material testing and characterization on microscopic and even on nanoscopic scale. E.g., defect initiation and propagation in multilayer structures applied in electronics, MEMS and MOEMS technology, the influence of material migration to mechanical behavior or defect development in ultra thin silicon dies often are not well understood. A key for micro material testing and characterization is the measurement of strains and displacements inside microscopic regions. Correlation techniques (e.g. micro DAC, nanoDAC) are one of the promising tools for that purpose. There application potentials to micro testing for packaging materials and components are demonstrated in the paper. More in detail approaches to CTE measurement, analysis of moisture-induced strains in polymers and crack testing are discussed. Furthermore, it is shown how the method can be used to study the mechanical response of complex micro components to thermo-mechanical loading.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dietmar Vogel, Astrid Gollhardt, and Bernd Michel "Micro/nano-DAC deformation measurement to analyze packaging components response to thermomechanical load", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462878
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