19 April 2002 Polysilicon surface-micromachined spatial light modulator with novel electronic integration
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Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462846
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France
Abstract
This paper presents a high-speed resolution phase-only microelectromechanical system (MEMS) spatial light modulator (SLM), integrated with driver electronics, using through- wafer vias and solder bump bonding. It employs a polysilicon thin film MEMS technology that is well suited to micromirror array fabrication and offers significant improvement in SLM speed in comparison to alternative modulator technologies. Vertical through-wafer interconnections offer scalability required to achieve 1M-pixel array size. The design, development, fabrication and characterization of a scalable driver integrated SLM is discussed. Pixel opto- electromechanical performance has been quantified experimentally on prototypes, and results are reported.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Clara E. Dimas, Clara E. Dimas, Thomas G. Bifano, Thomas G. Bifano, Paul A. Bierden, Paul A. Bierden, Julie A. Perreault, Julie A. Perreault, Peter A. Krulevitch, Peter A. Krulevitch, Ryan T. Roehnelt, Ryan T. Roehnelt, Steven Cornelissen, Steven Cornelissen, } "Polysilicon surface-micromachined spatial light modulator with novel electronic integration", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462846; https://doi.org/10.1117/12.462846
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