13 September 2002 Laser ablation of dielectrics using ultrashort and temporally shaped laser pulses
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Proceedings Volume 4760, High-Power Laser Ablation IV; (2002); doi: 10.1117/12.482080
Event: International Symposium on High-Power Laser Ablation 2002, 2002, Taos, New Mexico, United States
Abstract
A significant improvement in the quality of ultrafast laser micromachining of brittle dielectrics is demonstrated by using temporally shaped pulse trains with sub-ps separation, synchronized with the material specific relaxation times. The individual material response to laser radiation depends on the efficiency of electron generation and on the ability to release the energy into the lattice. Loss mechanisms in the electron population, surface charging, as well as the strength of the electron-phonon interactions control the effectiveness of the energy deposition into the lattice. Knowledge of the response times of materials establishes a guideline for using temporally shaped pulses or pulse trains in order to optimize the structuring process with respect to the efficiency of material removal and reduction of the residual damage. The sequential energy delivery induces a material softening during the initial steps of excitation changing the energy coupling for the subsequent steps. This leads to lower stress, cleaner structures, and provides a material-dependent optimization process.
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Razvan Stoian, Mark Boyle, Andreas Thoss, Arkadi Rosenfeld, Georg Korn, Ingolf V. Hertel, "Laser ablation of dielectrics using ultrashort and temporally shaped laser pulses", Proc. SPIE 4760, High-Power Laser Ablation IV, (13 September 2002); doi: 10.1117/12.482080; https://doi.org/10.1117/12.482080
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KEYWORDS
Picosecond phenomena

Modulation

Dielectrics

Laser ablation

Aluminum

Pulsed laser operation

Sapphire

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