9 August 2002 Laser cleaning in the process of electronic device production
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Proceedings Volume 4762, ALT'01 International Conference on Advanced Laser Technologies; (2002) https://doi.org/10.1117/12.478642
Event: International Conference on: Advanced Laser Technologies (ALT'01), 2001, Constanta, Romania
Due to the continuous technological development in microelectronics and generally in precise materials micromachining there is a continuous need to develop more effective techniques to clean impurities from the surface. Current cleaning techniques used in microelectric devices fabrication lines have an integrated action on the whole surface or on a great part of it, are polluting the ambient and are not efficient for submicron particles. Due to this needs we have studied laser cleaning of silicon wafers with regards to direct applications in semiconductor manufacturing. We have analyzed the ablation effect of laser radiation of 1.06 micrometers on different materials currently used in microelectronic industry and the cleaning effect on a silicon support.
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Ion G. Apostol, Ion G. Apostol, Dumitru Gh. Ulieru, Dumitru Gh. Ulieru, Razvan V. Dabu, Razvan V. Dabu, Constantin Ungureanu, Constantin Ungureanu, L. Rusen, L. Rusen, "Laser cleaning in the process of electronic device production", Proc. SPIE 4762, ALT'01 International Conference on Advanced Laser Technologies, (9 August 2002); doi: 10.1117/12.478642; https://doi.org/10.1117/12.478642

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