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9 September 2002 Evaluation of new UV-cured adhesives and effects of post-cure UV exposure
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Recent developments in adhesives have yielded products well suited for optical applications. Ultraviolet light-cured adhesives can be cured in seconds and are an attractive candidate. Selection of the adhesive properties can be made to achieve optimum performance. For improved alignment stability and reduced stress, low shrinkage adhesives have been needed. New UV-cured adhesives are evaluated with shrinkage values of less than 0.2%. In addition to controlled bonding for alignment stability, the effects of post-cure UV laser exposure (266 nm) are evaluated. Adhesives needed for systems employing UV lasers must consider off-axis exposure that can cause photo-reactive degradation. Relatively low power laser exposure is used as a simulated source for off-axis or scattered irradiation. None of these candidate adhesives are intended for in-the-light path use at 266 nm, but rather as structural adhesives. Evaluation of these candidates included a outgassing screening test that may be employed to select materials.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John G. Daly "Evaluation of new UV-cured adhesives and effects of post-cure UV exposure", Proc. SPIE 4771, Optomechanical Design and Engineering 2002, (9 September 2002);


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