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19 February 2003 Laser adjustment of beryllium copper sheet using temperature gradient mechanism
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Proceedings Volume 4830, Third International Symposium on Laser Precision Microfabrication; (2003)
Event: LAMP 2002: International Congress on Laser Advanced Materials Processing, 2002, Osaka, Japan
In order to realize a micro mechanical relay, a new technology of adjusting the characteristics of relays by laser has been developed. While IT-related mechanical relays have been increasingly miniaturized, the mechanical adjustment system by using the conventional spring material bending has already come to its limit in the adjustment process of relays. In attempt to overcome this situation, the application of laser forming, which is able to deal with miniaturization and is not influenced by spring back, was examined. However, as the beam spring used for relays involves a thin thickness and high thermal conductivity, the conventional technique of repeating laser irradiation, which induces damage of the surface and residual stress, to the same parts couldn’t adjust the displacement with accuracy. A technique that changes beam path in repeating laser irradiations was then applied. Consequently, with a minimal number of times of irradiation, the characteristics of relays can be adjusted by using laser without causing damage to the surface.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kosaku Kitada and Nobuyuki Asahi "Laser adjustment of beryllium copper sheet using temperature gradient mechanism", Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003);


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