Translator Disclaimer
19 February 2003 Laser structuring method for MID (LAMP2002)
Author Affiliations +
Proceedings Volume 4830, Third International Symposium on Laser Precision Microfabrication; (2003) https://doi.org/10.1117/12.486551
Event: LAMP 2002: International Congress on Laser Advanced Materials Processing, 2002, Osaka, Japan
Abstract
For the increasing demand of miniaturizing electro-optical devices, Molded Interconnect Device (MID) technology has been taken interest in recent year. MID is a three-dimensional molded component on which electronic circuitry is directly fabricated. The laser structuring process on MID includes the process of forming a copper thin film on a molded component and directly removing only the contour of the circuit using a laser beam. Forming a uniform copper thin film, the laser beam diameter can be made small enough to produce fine patterns with a 50/50 micrometers track/gap combination. This method also simplifies the process by eliminating the need for the photo-resist and mask required in conventional photo imaging processes. The combination of laser wavelength and molded material is carefully selected in consider of absorption characteristic. By controlling the first pulse and designing a circuit for avoiding field concentration during plating, the molded component is successfully processed without any damages. Using this method, the world’s smallest human detection sensor, “NaPiOn” has been developed.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Masahide Muto, Yoshiyuki Uchinono, Masayuki Hirota, and Toshiyuki Suzuki "Laser structuring method for MID (LAMP2002)", Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); https://doi.org/10.1117/12.486551
PROCEEDINGS
5 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

Development of an adiabatic laser calorimeter
Proceedings of SPIE (October 10 2000)
High-speed laser cutting of thin metal sheets
Proceedings of SPIE (September 06 1994)
Laser Welding & Drilling
Proceedings of SPIE (July 24 1979)

Back to Top