There is a proven potential of ultra-short laser pulses for precise cutting of all kinds of materials. Especially with regard to miniaturizations in the semiconductor industry, even industrial high-speed cutting processes nowadays aim for the precision of femtosecond laser systems. However, when working with a typical spot-focused laser beam on current standard systems, the processing speed is too low for an industrial cutting of larger parts as, for instance, silicon wafers. Apart from improving the laser systems with regard to pulse energies and repetition rates, it is therefore crucial to realize that material ablation can also be influenced by other process parameters. In case of straight microcuts e.g. in silicon wafers, a new approach is a beam shaping strategy using certain arrangements of cylindrical lenses. This can significantly contribute to an increase of the achievable cutting speed, and at the same time reduce the minimal kerf width while using the highest available laser power. We present examples of such kerfs in thin silicon wafers using a system of cylindrical lenses in comparison to a customary achromatic lens, and provide information about the focusing process and the chances and challenges entailed.