Surface-activated bonding for copper plate by excimer laser irradiation

Takashi Suzuki; Takao Araki; Minoru Nishida

doi:10.1117/12.486585

19 February 2003 Surface activated bonding for copper plate by excimer laser irradiation

Takashi Suzuki, Takao Araki, Minoru Nishida

Proceedings Volume 4830, Third International Symposium on Laser Precision Microfabrication; (2003) https://doi.org/10.1117/12.486585
Event: LAMP 2002: International Congress on Laser Advanced Materials Processing, 2002, Osaka, Japan

Abstract

When a pair of clean solid surface are brought close to the atoms distance in the vacuum, the solids were bonded by the gravitation and binding force. Such a way of bonding is called a surface activated bonding. In this work, a laser irradiated to a couple of copper plates surface under various conditions of laser irradiation. The surface oxidation layer and organic layer were removed by laser ablation. After the irradiation, a couple of copper plates surface get close to each other. The possibility of the bonding was examined by AFM.

Citation Download Citation

Takashi Suzuki, Takao Araki, and Minoru Nishida "Surface activated bonding for copper plate by excimer laser irradiation", Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); https://doi.org/10.1117/12.486585

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